ISO uses the term, Integrated Circuit Card (ICC) to encompass all those devices where an integrated circuit is contained within an ISO ID1 identification card. Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical characteristics. ISO/IEC specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which.
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Two transmission protocols are included in it: It is clear however that we should attempt to minimise the contents of the chip on both cost and reliability grounds commensurate with the particular application. This is the signal line by which the chip receives commands and interchanges data with the outside world. This is an additional characteristic to the magnetic field sensor which operates off the magnetic stripe and is used to open a mechanical gate on devices such as ATMs where some vandal proofing techniques are required.
According to its abstract, it specifies the operating conditions of an integrated circuit card that provides a USB interface. The now agreed ISO standards for magnetic stripes resulted in the French chip position and the magnetic stripe being coincident. PVC was traditionally used in the manufacture of cards and enabled a higher printing resolution.
ISO is the internationally accepted standard for smart cards. The asynchronous type of transmission is similar to that used by the serial RSC connector met on the personal computer. ETSI in the development of its standards has adopted a far 78166-1 rigorous specification of 20mA maximum for normal use and a 10mA maximum for use in portable equipment.
Many observers have commented that the widespread use of Smart Cards is being impeded by the lack 786-1 standards. The French Transac tracks were lower on the card which also made this position preferable. There are two commonly used clock speeds, 3.
The snag however is that it cannot be changed and takes several months to be produced by the semiconductor company. Whilst the memory is erasable by means of ultra violet light, the necessary quartz window is never available in the ICC and the memory is really used in one time programmable mode OTP. ISO standards by standard number. This means that the line must change direction depending on whether the IC is transmitting or receiving.
The first part of the process is to manufacture a substrate which contains the chip. From the requirements individual specifications can be prepared for the chip, card, mask ROM software and the application software.
In practice the semiconductor manufacturers have a range of products for which the above parameters are pre-defined. This part specifies the power, signal structures, and the structure for the answer to 78116-1 between an integrated circuit card s with synchronous transmission and an interface device such as a terminal. These commands cover the entire life cycle of isoo card and therefore some commands may be used before the card has been issued to the cardholder or after the card has expired.
The activation sequence for the interface device is defined as follows. The whole operation starts with the application requirements specification. Sio specification of a card involves parameters that are common to many existing applications using the ISO ID-1 card. Assuming the application is to be placed in the PROM memory of the IC then the next stage in the process is to load the code into the iao.
The 781-61 advantage of the CPU device is of course more significant because the CPU is capable of implementing cryptographic algorithms in its own right, but we will discuss this iwo more detail in due course.
The communications signal may be transmitted in a similar way or can use capacitive coupling or even an optical connection.
Commands for card management”. The security logic can be used to control access to the memory for authorised use only. The choice of card material effects the environmental properties of the finished product.
With tape automated bonding the dice is attached by thermocompression to copper leads supported on a flexible tape similar to a 35mm film.
This applies as much to telephone cards as applications using ICCs for cryptographic key carriers. Again this is an integral part of the overall security process. The relative location of these components when present is shown in figure Application code can be loaded into the PROM memory in minutes with no further reference to the chip manufacturer.
There is another bi-product that we will consider later where the cost of testing and personalisation are considerably altered by the complexity of the particular chip. Interindustry data elements for interchange”. It is even proposed that the chip micromodule could be inserted in one step as part of the moulding process. The die mounting and wire bonding processes involve a large number of operations and are therefore quite expensive. This part specifies characteristics for a magnetic stripe, the encoding technique and coded character sets which are intended for machine reading.
ISO/IEC – Wikipedia
The random access memory RAM is a different kettle of fish, this is volatile memory and as soon as the power is removed the data content is lost. Cancel reply Your email address will not be published. Both of these parameters have problems. This is in itself an integral and complex process that we shall describe later in more detail. While this is certainly one way of comparing cards fabricated by different companies, whether it bears any relationship to the use of IC cards in the field seems debatable.
It defines the basic commands for reading, writing and updating of card data. The relevant part of the ISO standard is commands. The subject of multi-applications and particularly the implementation of security segregation is another subject for more detailed discussion in subsequent parts. Leave this field empty. As mentioned previously, security may be an important issue for the application and accordingly there may be extra requirements on the physical and logical security offered by the particular chip.
The ICC which contains a CPU can handle more sophisticated applications and even multi applications since the CPU is also capable of processing the data and taking decisions upon the various actions that may be invoked.
One of the issues surrounding the use of the IC card relates to the temperature range for operational use. Hence the fundamental component of the IC is ido memory module.