LM4766T DATASHEET PDF

LM4766T DATASHEET PDF

LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.

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The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM The LM has a sophisticated thermal protection scheme. SPiKe Protection Circuitry is not enabled.

Single Supply Application Circuit. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated close to the package terminals.

Please refer to AN for more detailed information. Equation 1 exemplifies the datasheet maximum power dis- sipation point of each amplifier where V CC is the total supply voltage.

Once the maximum package power dissipation has been. Numbers in parentheses represent pinout for amplifier B. The choice of a heat sink for a high-power audio amplifier is.

Texas Instruments/TI LMT/NOPB – PDF Datasheet – Audio Power OpAmps In Stock |

The package dissipation is twice the number which re. An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power. Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down. Upon system power-up, the under-voltage protection cir.

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PDF LM4766T Datasheet ( Hoja de datos )

This greatly reduces the stress imposed on the IC by. Equation 1 exemplifies the theoretical maximum power dis. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together.

It starts operating again dataheet the die temperature. These instabilities can be eliminated through multiple. Each amplifier within the LM has an independent. SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks.

Refer to the graphs of Power Dissipation versus. The LM is a stereo audio amplifier capable of delivering. Operating graph in the Typical Performance Characteris. The clamping effect is quite ,m4766t same.

Output Power in the Typical Performance Characteristics. SPiKe Protection means that these. The thermal resistance from the die junction to the outside. The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes.

Typical Audio Amplifier Application Circuit. Thus by knowing the total supply voltage and rated output.

Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion. Special Audio Amplifier Application Circuit. The LM is protected from instantaneous peak. The LM contains over-voltage protection circuitry that. This calculation is made using Equation 3. Single Supply Amplifier Application Circuit. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated.

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Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical lm47666t, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: However, to improve system. This greatly reduces the stress imposed on the IC by thermal cycling, which lm4766y turn improves its reliability under sustained fault conditions.

Special Audio Amplifier Application Circuit 5 www. LM should have its supply leads bypassed with. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section.

The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. The LM has excellent power supply rejection and does.

Taking into account supply line fluc. Auxiliary Amplifier Application Circuit.

Since the die temperature is directly dependent upon the. Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which show the actual full range of power dissipation not just the maximum theoretical point that results from Equation 1.

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