IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.
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A maximum of 5 devices shall be contained in a tray. Gel Trays must be labeled on the cover and the bottom of the base with the supplier lot number and part number, PO number and BAE part number. Use of newsprint, excelsior, or loosed fill expanded polystyrene is not allowed as a means of cushioning. Individual Comp Carrier General Requirements: Tubes for Surface-Mounted Components Definition: Moisture content prior to packaging shall not exceed 0.
Additional information on this requirement can be found at the following site: Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover.
This code shall only be used on product provided by through Integrated Supplier Partnering Agreements. If there are any questions contact Microwave Manufacturing Engineering 6. The carrier shall have removable stops on each end and shall prevent the components from shifting in any direction.
SMI only General Requirements: A rigid container that holds one leaded component. Tubes Only General Requirements: Specific packaging requirements will be provided by the using factory through the supplier electronic replenishment process. Matrix Tray General Requirements: A carrier that holds multiple components in a row. Moisture transfer refers to the fact that certain solid waste Each moisture barrier bag shall be marked with the part number, date code, quantity, and serial numbers of the PWBs enclosed.
The Gel retention level must be ipcc minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied. Once a Tray is chosen all components of that size for the entire P. Do not handle with bare hands; use clean, lint free cotton gloves when handling. Use of newsprint, excelsior or loose fill expanded polystyrene shall be avoided as a means of cushioning.
Special Packaging Package parts per instructions specified by purchase order or subcontracts, i. If there are any questions contact Microwave Manufacturing Engineering.
Exterior containers shall comply with uniform freight and national motor freight classification rules or regulations or other carrier rules, as applicable to lpc mode of transportation.
Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover 4. Items that are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices.
Basin and Range Province PowerPoint. Compliance Commitments related to the manufacture and.
Matte finish waffle packs should be used if available. Multiple boards in an MBB shall be separated by slip sheets or other appropriate materials such as pink poly bags.
Items that are gold plated or have a 16 finish or lower shall contain the following note marked on exterior of container: Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs.
Surface mount components shall be suitable for vacuum pick up, include caps as applicable. Preferred cavity depth should not exceed more than 20 mils above the top of the component.
Moisture content may be assured by documented process controls or appropriate testing. Use of any static generating material is strictly prohibited. These carriers shall support the body of the component, maintain all physical lead dimensions, and allow visibility of the contact shall be such that no ilc is applied to the leads. For shelf life requirements beyond one year place a in the Q.
Packaging Requirement Codes
Best Commercial Practice Packaging of parts shall be sufficient to afford protection against deterioration and physical damage during shipment from the supply source to BAE Systems. Use of newsprint, excelsior, or loosed fill expanded polystyrene shall be avoided as a means of cushioning.
Tray covers will also consists of black static dissipative material held to the base with a one piece clip. Each moisture barrier bag may contain up to 10 PWBs of size in2 per side or greater, and smaller boards may be packaged up to 25 per bag. Once a Wafflepack is chosen all components of that size for the entire P.
Parts do not have to be pre-oriented, but must be face up.
IPC – Moisture Sensitivity Classification for Non-IC Components
Items which are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. The lid must be capable of being removed without disturbing the parts within the tray and the part no.
Minimum cavity depth is the same height as that of the component. Waffle pack capacity should ipf maximized within a manufacturing lot.
Elements or components that are Class 0 Sensitive shall be lpc marked as Class 0 on the external surface of the packaging. The preferred cavity size should be mils. The packaging shall allow the polarity or part number markings to be visible for each device.